DXN, an Australian manufacturer known for its containerized data center solutions, has unveiled its cutting-edge liquid-cooled module. This new offering, designed to meet the demands of high-performance computing (HPC) and artificial intelligence (AI) applications, provides direct-to-chip cooling, which is essential for managing the heat generated by modern, dense computing workloads.
Key Features of DXN’s Liquid-Cooled Modules
The DXN liquid-cooled pods come in two configurations: 1MW and 2MW designs. Each module is equipped with the capability to scale up, allowing customers to link multiple units together, resulting in capacities of up to 10MW or 20MW. These modular systems are tailored for environments that demand significant computational power while maintaining efficiency in cooling and energy consumption.
The direct-to-chip cooling technology enables these pods to support up to 100kW or 200kW per rack, making them ideal for AI, machine learning, and HPC applications that require extreme computational capabilities and efficient thermal management.
Customizable Cooling Solutions
DXN’s liquid-cooled pods can be configured with either a centralized cooling distribution unit (CDU) or an in-rack solution, providing flexibility to meet diverse customer needs. This customization ensures that the modules can be adapted to various data center layouts and operational requirements, allowing for optimized cooling across a range of applications.
Proven Track Record with High-Profile Clients
DXN has a strong history of providing containerized solutions to top-tier clients across various industries. Notable customers include major mining corporations such as AngloAmerican and Newcrest, as well as aerospace giant Boeing and energy companies like Covalent Lithium and Pilbara Minerals. The company has also delivered critical infrastructure, including landing station modules for subsea cables, to locations such as the Cocos (Keeling) Islands and Palau.
Recently, DXN signed a deal to provide another landing station module to Timor-Leste, further expanding its reach in the global market for containerized data center solutions.
Why Liquid Cooling is Essential for Modern Data Centers
Benefits of Direct-to-Chip Cooling Technology
Direct-to-chip liquid cooling represents a significant advancement over traditional air cooling systems. By directly channeling coolant to the heat-generating components, this method can efficiently manage higher heat loads, allowing data centers to handle denser computing power without compromising performance or energy efficiency.
As AI and HPC workloads continue to increase in scale and complexity, liquid cooling solutions become more vital in maintaining operational stability and lowering energy consumption. DXN’s liquid-cooled pods address these challenges by providing effective heat dissipation while also optimizing energy efficiency, making them a sustainable choice for modern data centers.
Scalability and Flexibility for Growing Data Center Needs
The scalability of DXN’s liquid-cooled modules makes them an attractive option for businesses looking to expand their data center operations. With the ability to connect multiple pods together, customers can seamlessly increase their capacity from 1MW or 2MW up to 10MW or even 20MW. This flexibility is crucial for companies experiencing rapid growth in data demand, as it allows them to scale their infrastructure without significant overhauls or disruptions to operations.
The Future of Data Center Cooling
Sustainability and Energy Efficiency at the Forefront
As the demand for more computational power grows, the need for more sustainable and efficient cooling methods becomes critical. DXN’s liquid-cooled modules align with these goals, offering a cooling solution that not only manages heat more effectively but also helps reduce the environmental footprint of data centers.
With industries increasingly focused on sustainability, adopting liquid cooling technology like that of DXN can provide significant advantages, including lower energy costs and a reduced carbon footprint, positioning companies to meet both operational and environmental goals.
FAQ
1. What is direct-to-chip liquid cooling, and why is it important?
Direct-to-chip liquid cooling involves circulating liquid coolant directly to the heat-producing components of a data center’s computing hardware. This method effectively dissipates heat, enabling data centers to support higher-density workloads without overheating, essential for AI and HPC applications.
2. What are the capacity options for DXN’s liquid-cooled modules?
DXN offers its liquid-cooled modules in 1MW and 2MW configurations. These can be connected in series, providing scalable solutions that reach up to 10MW or 20MW, depending on customer needs.
3. How does liquid cooling compare to traditional air cooling?
Liquid cooling is more efficient than air cooling, particularly for high-density workloads. It directly targets heat sources with a liquid coolant, significantly improving cooling efficiency, lowering energy consumption, and supporting higher-powered systems.
4. Can DXN’s liquid-cooled modules be used for smaller data centers?
Yes, the modular nature of DXN’s system makes it highly flexible, allowing businesses to start with a 1MW or 2MW module and scale up as needed. This adaptability makes it suitable for both small and large data centers.
5. What industries benefit from DXN’s liquid-cooled data center solutions?
DXN’s modules are ideal for industries that require substantial computational power, such as high-performance computing (HPC), artificial intelligence (AI), mining, energy, and aerospace.
