Compute, Storage & Networking
Rapidus Installs Japan’s First ASML TWINSCAN NXE:3800E for 2nm Chip Breakthrough at IIM-1 Foundry in Hokkaido
Japanese chipmaker Rapidus has announced the successful installation of ASML's TWINSCAN NXE:3800E, a state-of-the-art EUV lithography machine. This system will be a critical component in Rapidus' new IIM-1 foundry located…
DOE Announces $625 Million for New Quantum Research Centers in Computing, Sensing, and Materials
The U.S. Department of Energy (DOE) has unveiled a significant funding opportunity…
SMART USA Secures $285M CHIPS Act Funding to Lead Semiconductor Innovation with Digital Twin Technology
The U.S. Department of Commerce has announced a $285 million funding award…
Elektros and Next Realm AI Partner to Build Sustainable Private AI Data Centers for Industry Transformation
Elektros, a US-based company specializing in electric mobility and lithium-ion battery development,…
Netherlands Launches €12 Million ChipNL Competence Centre to Boost Semiconductor Innovation and Support European Startups
The Netherlands has inaugurated the ChipNL Competence Centre, a key initiative designed…
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The Latest
Seagate Starts Shipping 36TB Exos M Hard Drives with HAMR Technology, Offering 60% Energy Savings
Seagate Technology has officially started shipping samples of its latest hard drive, the 36TB Exos M, leveraging the company’s groundbreaking…
TSMC Confirms Taiwan Fabs Are Fully Operational After 6.4 Magnitude Earthquake Strikes
Earthquake Strikes Southern Taiwan Early Morning On January 21, a powerful 6.4 magnitude earthquake struck southern Taiwan, affecting several regions,…
Nvidia and TSMC Partner to Revolutionize Silicon Photonics for Data Centers
What is the Partnership Between Nvidia and TSMC? Nvidia has officially joined forces with Taiwan Semiconductor Manufacturing Company (TSMC) to…
GlobalFoundries Launches Groundbreaking Advanced Packaging & Photonics Center in New York
What is GlobalFoundries’ New Advanced Packaging and Photonics Center? GlobalFoundries (GF) has announced the development of an Advanced Packaging and…
University of Ljubljana Invests €2.5M in Cutting-Edge Modular Data Center to Propel AI and Slovenian LLM Research
The University of Ljubljana’s Faculty of Computer and Information Science in Slovenia is set to introduce a state-of-the-art modular data…
University of Stuttgart Unveils $15M ‘Hunter’ Supercomputer for Sustainable High-Performance Computing
The University of Stuttgart has officially launched its Hunter supercomputer, marking a significant advancement in Germany's high-performance computing (HPC) capabilities.…
DOE Announces $625 Million for New Quantum Research Centers in Computing, Sensing, and Materials
The U.S. Department of Energy (DOE) has unveiled a significant funding opportunity to advance quantum research. The $625 million initiative…
Biden Administration Adds 16 Companies to Entity List Over ‘National Security Risks’
US National Security Concerns Lead to New Sanctions The Biden Administration has placed 16 additional companies on the US Department…
SiTime’s New Super-TCXO Enhances AI Compute Cluster Synchronization by 3X, Revolutionizing Data Center Efficiency
SiTime, a leader in precision timing technology, has unveiled its SiT5977 Super-TCXO, a single-chip timing solution designed to significantly enhance…
Alibaba, Apple, and Synopsys Join UALink Consortium to Accelerate AI Accelerator Connectivity with 200 Gbps Solutions
In a significant move for the tech industry, Alibaba, Apple, and Synopsys have joined the Ultra Accelerator Link (UALink) Consortium.…